1.介質(zhì)漿料 Media Paste
適用于不銹鋼(304、403)等金屬基材制成電熱板的隔離介質(zhì)漿料,具有很好的印刷性,對多種金屬的附著力好,相容性好,耐溫度高,電氣絕緣度高(燒結(jié)膜厚:58-62um,交流擊穿電壓>2000V),具體請來電來函咨詢。
Isolation medium Paste suitable for electric-heat board with the metal substrate of stainless steel (304,403), excellent printability, good adhesion on many kinds of metals, good compatibility, resistant to high temperature, high electrical insulation degree (sintering film’s thickness :58-62um, AC breakdown voltage> 2000V), welcome to call us for details.
2. 透明包封漿料transparent encapsulation paste
透明度很高,被包封電阻變化率小,無色透明、彩色透明均可提供,歡迎來電來函咨詢。
high transparency, the rate of encapsulated resistance’s change is small, transparent colorless and transparent color pastes are available, welcome to call us for details.
3. 耐高溫包封漿料 high temperature encapsulation paste
適用于高溫領(lǐng)域厚膜電路的包封,對多種基材的附著力優(yōu)異,長期耐溫小于550℃,電氣絕緣度高,包封漿料干膜平滑、致密,具體請來電來函咨詢。
Be suitable for encapsulating thick film circuit in high temperature fields, excellent adhesive on many kinds of substrates, long-term working temperature below 550℃,high electrical insulation degree, sintering film: Smooth and dense, welcome to call us for details.
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